Electric vehicle inverter module heat sink

ABSTRACT

Provided herein are a heat sink module of an inverter module to power an electric vehicle. The heats sink module can include a heat sink body having a plurality of mounting holes, a fluid inlet and a fluid outlet. The heats sink module can include a cooling channel that can be fluidly coupled with the fluid inlet and the fluid outlet. The heats sink module can include an insulator plate having a first surface and a second surface. The second surface of the insulator plate can couple with a joining surface of the heat sink body to seal the cooling channel. The heats sink module can include a heat sink lid disposed over the insulator plate. The heat sink lid can have a plurality of mounting feet to couple with the mounting holes of the heat sink body to secure the heat sink lid to the heat sink body.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of priority under 35 U.S.C. §120 as a continuation of U.S. patent application Ser. No. 16/234,242,filed Dec. 27, 2018, and titled “ELECTRIC VEHICLE INVERTER MODULE HEATSINK,” which claims the benefit of priority under 35 U.S.C. § 120 as acontinuation of U.S. patent application Ser. No. 16/110,559, filed Aug.23, 2018 and titled “ELECTRIC VEHICLE INVERTER MODULE HEAT SINK,” whichclaims the benefit of priority under 35 U.S.C. § 119(e) to U.S.Provisional Application 62/663,192, filed on Apr. 26, 2018, titled“ELECTRIC VEHICLE INVERTER MODULE HEAT SINK,” each of which isincorporated herein by reference in its entirety.

BACKGROUND

Batteries can include electrochemical materials to supply electricalpower to various electrical components connected thereto. Such batteriescan provide electrical energy to various electrical systems.

SUMMARY

Systems and methods described herein relate to a multiple phase invertermodule formed having three power modules (which can also be referred toherein as half-bridge modules, half-bridge inverter modules orsub-modules) arranged for example in a triplet configuration forelectric vehicle drive systems. Each of the power modules can include atleast one heat sink module to provide active cooling to other components(e.g., capacitor, transistors) within the respective power module. Theinverter module can be coupled with a drive train unit of an electricvehicle and can provide three phase voltages to the drive train unit.For example, each of the power modules can generate a single phasevoltage and thus, the three half-bridge modules arranged in a tripletconfiguration can provide three phase voltages.

At least one aspect is directed to a heat sink module of an invertermodule to power an electric vehicle. The heat sink module can include aheat sink body having a plurality of mounting holes, a fluid inlet and afluid outlet. The heat sink module can include a cooling channel formedin the heat sink body. The cooling channel can be fluidly coupled withthe fluid inlet and the fluid outlet. The heat sink module can includean insulator plate coupled with the heat sink body. The insulator platecan have a first surface and a second surface. The second surface of theinsulator plate can couple with a joining surface of the heat sink bodyto seal the cooling channel. The heat sink module can include a heatsink lid disposed over the first surface of the insulator plate. Theheat sink lid can have a plurality of mounting feet to couple with themounting holes of the heat sink body to secure the heat sink lid to theheat sink body.

At least one aspect is directed to a method of providing a heat sinkmodule of an inverter module to power an electric vehicle. The methodcan include providing a heat sink body of a heat sink module. The methodcan include forming a plurality of mounting holes, a fluid inlet and afluid outlet in the heat sink body. The method can include forming oneor more cooling channels in the heat sink body. The cooling channels canbe fluidly coupled with the fluid inlet and the fluid outlet. The methodcan include coupling an insulator plate with the heat sink body. Theinsulator plate can have a first surface and a second surface. The firstsurface can correspond to a cooling surface. The second surface of theinsulator plate can couple with a joining surface of the heat sink bodyand seal the one or more cooling channels. The method can includedisposing a heat sink lid over the first surface of the insulator plate.The heat sink lid can have a plurality of mounting feet to couple withthe mounting holes of the heat sink body to secure the heat sink lid tothe heat sink body.

At least one aspect is directed to a method. The method can includeproviding a heat sink module of an inverter module to power an electricvehicle. The heat sink module can include a heat sink body having aplurality of mounting holes, a fluid inlet and a fluid outlet. The heatsink module can include a cooling channel formed in the heat sink body.The cooling channel can be fluidly coupled with the fluid inlet and thefluid outlet. The heat sink module can include an insulator platecoupled with the heat sink body. The insulator plate can have a firstsurface and a second surface. The second surface of the insulator platecan couple with a joining surface of the heat sink body to seal thecooling channel. The heat sink module can include a heat sink liddisposed over the first surface of the insulator plate. The heat sinklid can have a plurality of mounting feet to couple with the mountingholes of the heat sink body to secure the heat sink lid to the heat sinkbody.

At least one aspect is directed to an electric vehicle. The electricvehicle can include a heat sink module for an inverter module of anelectric vehicle. The heat sink module can include a heat sink bodyhaving a plurality of mounting holes, a fluid inlet and a fluid outlet.The heat sink module can include a cooling channel formed in the heatsink body. The cooling channel can be fluidly coupled with the fluidinlet and the fluid outlet. The heat sink module can include aninsulator plate coupled with the heat sink body. The insulator plate canhave a first surface and a second surface. The second surface of theinsulator plate can couple with a joining surface of the heat sink bodyto seal the cooling channel. The heat sink module can include a heatsink lid disposed over the first surface of the insulator plate. Theheat sink lid can have a plurality of mounting feet to couple with themounting holes of the heat sink body to secure the heat sink lid to theheat sink body.

These and other aspects and implementations are discussed in detailbelow. The foregoing information and the following detailed descriptioninclude illustrative examples of various aspects and implementations,and provide an overview or framework for understanding the nature andcharacter of the claimed aspects and implementations. The drawingsprovide illustration and a further understanding of the various aspectsand implementations, and are incorporated in and constitute a part ofthis specification.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are not intended to be drawn to scale. Likereference numbers and designations in the various drawings indicate likeelements. For purposes of clarity, not every component can be labeled inevery drawing. In the drawings:

FIG. 1 depicts an example view of a lid portion of a heat sink of aninverter module of a drive unit of an electric vehicle; according to anillustrative implementation;

FIG. 2 depicts an example exploded view of a heat sink of an invertermodule of a drive unit of an electric vehicle, showing of a bottomportion and an insulation plate of the heat sink, according to anillustrative implementation;

FIG. 3 is an example exploded view of a single phase power module of amultiple phase inverter module of a drive unit of an electric vehicle;according to an illustrative implementation;

FIG. 4 is a block diagram depicting a cross-sectional view of an exampleelectric vehicle installed with a battery pack;

FIG. 5 depicts a flow diagram of an example method of forming a heatsink module of an inverter module of an electric vehicle, according toan illustrative implementation; and

FIG. 6 depicts a flow diagram of an example method of providing a heatsink module of an inverter module of an electric vehicle, according toan illustrative implementation.

DETAILED DESCRIPTION

Following below are more detailed descriptions of various conceptsrelated to, and implementations of heat sink modules for battery packsin electric vehicles. The various concepts introduced above anddiscussed in greater detail below can be implemented in any of numerousways.

Systems and methods described herein relate to a heat sink module (orheat sink) of an inverter module of a drive train unit of an electricvehicle. The drive train unit of an electric vehicle can include one ormore inverter modules. For example, the drive train unit can include amultiple phase inverter module formed having three power modules (whichcan also be referred to herein as half-bridge modules, half-bridgeinverter modules or sub-modules) arranged for example in a tripletconfiguration for electric vehicle drive systems. Each of the powermodules can include at least one heat sink to provide active cooling toelectrical components, such as but not limited to, a capacitor ortransistors within the respective power module. The multiple phaseinverter module can be coupled with a drive train unit of an electricvehicle and can provide three phase voltages to the drive train unit.For example, each of the power modules can generate a single phasevoltage and thus, the three power modules arranged in a tripletconfiguration can provide three phase voltages.

FIG. 1, among others, depicts a heat sink module 100. The heat sinkmodule 100 can be a component of a power module (e.g., power module 300as in the example of FIG. 3) that is disposed within an inverter module(e.g., inverter module 450 as in the example of FIG. 4) of a drive trainunit of an electric vehicle (e.g., electric vehicle 405 as in theexample of FIG. 4). For example, the heat sink module 100 can be acomponent of a single phase power module that is coupled with two othersingle phase power modules to form a three phase inverter module of adrive train unit of an electric vehicle. The heat sink module 100 canprovide active cooling to the other components, such as electricalcomponents (e.g., capacitor, transistors) of a power module. Forexample, the components of the power module, including but not limitedto transistors, capacitors, bus bars may not have sufficient oreffective cooling. Further, unreliable sealing of coolant may causeelectrical shorts and the cooling components can be expensive tomanufacture or hard to scale for mass production. The heat sink modules100 described herein can provide cooling (e.g., active cooling, passivecooling) to the electrical components or electrical elements of thepower module. For example, the heat sink module 100 can be positioned ordisposed within a power module such that it is in contact withelectrical components such as, but not limited to, a capacitor ortransistors of the respective power module. The heat sink module 100 caninclude sealing surfaces or sealing components to provide reliablesealing of coolant used to cool the electrical components or electricalelements of a power module and the sealing surfaces or sealingcomponents can be scaled for mass production and less expensive tomanufacture. For example, the heat sink module 100 can provide activecooling to transistors, capacitors, bus bars (e.g., positive bus bar,negative bus bar, phase bus bar), and any electrical components orelements disposed about or surrounding the transistors, capacitors, andbus bars of the respective power module.

The heat sink module 100, including a heat sink lid (e.g., heat sink lid200 as in the example of FIG. 2), an insulator plate (e.g., insulatorplate 150 as in the example of FIG. 1) and a heat sink body (e.g., heatsink body 105 as in the example of FIG. 1), can have a length in a rangefrom 200 mm to 225 mm (e.g., 215 mm). A height of the heat sink module100, including a heat sink lid (e.g., heat sink lid 200 as in theexample of FIG. 2), an insulator plate (e.g., insulator plate 150 as inthe example of FIG. 1) and a heat sink body (e.g., heat sink body 105 asin the example of FIG. 1), can range from 10 mm to 20 mm (e.g., 13 mm).A width of the heat sink module 100, including a heat sink lid (e.g.,heat sink lid 200 as in the example of FIG. 2), an insulator plate(e.g., insulator plate 150 as in the example of FIG. 1) and a heat sinkbody (e.g., heat sink body 105 as in the example of FIG. 1), can rangefrom 45 mm to 65 mm (e.g., 52 mm). The length, height, and width of theheat sink module 100 can vary within or outside these ranges. The heatsink module 100 can include a variety of different materials, such asbut not limited to, conductive material, metal material, metallicmaterial or aluminum.

The heat sink module 100 can include a heat sink body 105. The heat sinkbody 105 can have a length in a range from 200 mm to 225 mm (e.g., 215mm). A height of the heat sink body 105 can range from 5 mm to 20 mm(e.g., 10 mm). A width of the heat sink body 105 can range from 45 mm to65 mm (e.g., 52 mm). The length, height, and width of the heat sink body105 can vary within and outside these ranges. The heat sink body 105 caninclude a variety of different materials, such as but not limited to,conductive material, metal material, metallic material or aluminum. Theheat sink body 105 can include a plurality of connection points 110. Theconnection points 110 can be formed on one or more surfaces of the heatsink body 105. For example, the connection points 110 can be formed onside surfaces of the heat sink body 105 to couple the heat sink body 105with a heat sink lid (e.g., lid body 205 as in the example of FIG. 2).The heat sink body 105 can include a single connection point 110 ormultiple connection points 110. For example, the heat sink body 105 caninclude a first plurality of connection points 110 formed on a firstside surface of the heat sink body 105 and a second plurality ofconnection points 110 formed on a second side surface of the heat sinkbody 105. The second side surface can be an opposite or opposing sidesurface as compared to the first side surface. The number of connectionpoints 110 formed on the different surfaces of the heat sink body 105can be selected to correspond to the number of connection points 110formed on corresponding surfaces of a heat sink lid (e.g., lid body 205as in the example of FIG. 2). For example, the heat sink body 105 canhave the same number of connection points 110 as the heat sink lid. Theconnection points 110 can be formed from a variety of differentmaterials, including but not limited to, plastic material ornon-conductive material.

The heat sink body 105 can include a plurality of mounting feet 115(e.g., mounting boss). The mounting feet 115 can include a variety ofdifferent materials, including but not limited to, plastic material ornon-conductive material. The mounting feet 115 can couple with mountingholes or other forms of connection points of other components of aninverter module. For example, the mounting feet 115 can be arranged orpositioned along a surface (e.g., bottom surface, top surface) of theheat sink body 105. The mounting feet 115 can extend perpendicular withrespect to a surface (e.g., bottom surface, top surface) of the heatsink body 105 to couple with corresponding mounting holes formed inother components of an inverter module, for example, but not limited to,mounting holes formed in a capacitor or capacitor frame. The mountingfeet 115 can have a round shape, circular shape, octagonal shape, orrectangular shape. The mounting feet 115 can have a threaded outersurface to couple with a threaded inner surface of, for example,mounting holes. The mounting feet 115 can have a smooth outer surface tocouple with an inner surface of, for example, mounting holes. Themounting feet 115 can have a variety of different shapes, sizes ordimensions and the shape, size or dimensions of a particular mountingfeet 115 can be selected based at least in part on the dimensions of thelid body 205 or the heat sink body 105. The heat sink body 105 caninclude a single mounting foot 115 or multiple mounting feet 115. Forexample, the number of mounting feet 115 can be selected to correspondto the number of connection points or mounting holes on other componentsof the inverter module, such as but not limited to, a capacitor. Forexample, the number of mounting feet 115 formed on the heat sink body105 can be the same as the number of mounting holes formed on acapacitor of an inverter module. The mounting feet 115 can couple withmounting holes or other forms of connection points on a gel tray (e.g.,plastic gel tray). For example, a gel tray or insulation layer can bedisposed over or coupled with the heat sink module 100 and the mountingfeet 115 can couple with mounting holes on the gel tray to secure thegel tray with the heat sink module 100.

The heat sink body 105 can include a plurality of mounting holes 120.The mounting holes 120 can couple with, receive, engage, or secure theheat sink body 105 with mating parts (e.g., mounting feet) or connectionpoints on other components of an inverter module, for example, of a heatsink lid (e.g., lid body 205 as in the example of FIG. 2). The mountingholes 120 can couple with or secure a transistor locator (e.g., plasticIGBT locator) to the heat sink body 105 and thus, to the heat sinkmodule 100 during a manufacture process. For example, the transistorlocator can position one or more transistors within an inverter moduleand the transistor locator can be coupled with the heat sink module 100through one or more mounting holes 120 during the installation of thetransistors.

The mounting holes 120 may include holes, orifices, or hollow portionsformed through one or more portions of the heat sink body 105. Themounting holes 120 can be formed completely though a portion of the heatsink body 105 or may be formed up to a certain depth into a surface ofthe heat sink body 105. The mounting holes 120 may include a threadedinner surface to receive or engage a threaded outer surface of afastener, screw, bolt, or mounting feet. The mounting holes 120 mayinclude a threaded inner surface to receive or engage a threaded outersurface of a fastener, screw, bolt, or mounting feet. The mounting holes120 can have a round shape, circular shape, octagonal shape, orrectangular shape. The mounting holes 120 can have a variety ofdifferent shapes, sizes or dimensions and the shape, size or dimensionsof a particular mounting hole 120 can be selected based at least in parton the dimensions of the heat sink body 105. The heat sink body 105 caninclude a single mounting hole 120 or multiple mounting holes 120. Forexample, the number of mounting holes 120 can be selected to correspondto the number of connection points or mounting feet of other componentsof the inverter module, such as but not limited to, a heat sink lid body(lid body 205 as in the example of FIG. 2). For example, the number ofmounting holes 120 formed on the heat sink body 105 can be the same asthe number of mounting feet or connection points formed on a heat sinklid body of an inverter module.

The heat sink body 105 can include an open inner region 125. The openinner region 125 can be arranged such that portions of other componentsof an inverter module can be disposed within or through the open innerregion 125 to provide additional cooling to the respective components.For example, portions of a capacitor, such as but not limited to,positive terminals or leads and negative terminals or leads, can bedisposed within or extend through the open inner region 125. As the openinner region 125 of the heat sink body 105 can be disposed about,disposed around or otherwise surround the positive terminals or leadsand negative terminals or leads of the capacitor, the open inner region125 can provide active cooling to these components. The open innerregion 125, in additional to other cooling components of the heat sinkmodule 100, can reduce an inductance value of the inverter module andreduce EMI noise within the inverter module. For example, the design,shape, or geometry of the open inner region 125 can allow coolant fluiddisposed within the heat sink module 100 (e.g., cooling channels) to bepositioned adjacent to, proximate to or otherwise closer to the positiveterminals or leads and negative terminals or leads of the capacitor toprovide active cooling. The width of the open inner region 125 can rangefrom 10 mm to 20 mm (e.g., 12 mm). The length of the open inner region125 can range from 140 mm to 160 mm (e.g., 150 mm). The height of depthof the inner region 125 can range from 3 mm to 15 mm (e.g., 4 mm, 8 mm).The width, length, or height of the open inner region 125 can varywithin or outside these ranges.

The heat sink body 105 can include at least one cooling channel 130. Thecooling channel 130 can hold or contain fluid, such as coolant, toprovide active cooling to other components of an inverter module, suchas but not limited to, a capacitor or transistors. The cooling channel130 can extend a length of the heat sink body 105. The cooling channel130 can form an inner area or interior of the heat sink body 105. Forexample, the heat sink body 105 can include or have a shape that definesone or more cooling channels 130 (e.g., U shape or hollowed out innerportion). The cooling channel 130 can have a width in a range of about15 mm to about 25 mm (e.g., 20 mm). The cooling channel 130 can have aheight or depth in a range of 4 mm to 5 mm (e.g., 4.5 mm). The coolingchannel 130 can have a length 190 mm to 210 mm. The width, height,depth, or length of the cooling channel 130 can vary within and outsidethese ranges.

The heat sink body 105 can include a single cooling channel 130 ormultiple cooling channels 130 (e.g., two or more cooling channels 130).For example, the heat sink body 105 may include a first cooling channel130 and a second cooling channel 130. The first cooling channel 130 andthe second cooling channel 130 can be fluidly coupled such that thefirst cooling channel 130 and the second cooling channel 130 form onecooling channel and refer to portions or regions of the single coolingchannel 130 disposed parallel with respect to each other. The firstcooling channel 130 and the second cooling channel 130 can be separatecooling channels and form separate compartments or regions within theheat sink body 105. For example, the first cooling channel 130 and thesecond cooling channel 130 can have a common, unique or different inputsto receive fluid (e.g., coolant fluid) and outputs to release ordischarge fluid. The heat sink body 105 may include one or more heatfins. The heat fins can provide cooling and thermal dissipation. Theheat fins can include an extended surface or an extended surface areaformed in the cooling channel 130 to provide more surface area for fluiddisposed within the cooling channel 130 to flow over or around and thusprovide a greater amount of cooling. The density, thickness, shape ordimensions of the cooling fins can be selected based at least in part ondimensions of the heat sink body and pressure parameters within the heatsink module 100. For example, the cooling fins density, shape ordimensions can be selected or optimized to provide cooling whilemaintaining relative low pressure drop.

The heat sink body 105 can include at least one fluid inlet 135. Thefluid inlet 135 can include an orifice formed in the heat sink body 105to receive or provide fluids to one or more cooling channels 130. Forexample, the fluid inlet 135 can receive coolant fluid and provide thefluid to at least one cooling channel 130. The heat sink body 105 caninclude a single fluid inlet 135 or multiple fluid inlets 135. Forexample, the heat sink body 105 can include at least one fluid inlet 135for each cooling channel 130. The heat sink body 105 can include atleast one fluid outlet 137. The fluid outlet 137 can include an orificeformed in the heat sink body 105 to release or discharge fluid from oneor more cooling channels 130. For example, the fluid outlet 137 canrelease coolant fluid from at least one cooling channel 130. The heatsink body 105 can include a single fluid outlet 137 or multiple fluidoutlets 137. For example, the heat sink body 105 can include at leastone fluid outlet 137 for each cooling channel 130. The fluid inlet 135can be the same as the fluid outlet 137. For example, the heat sink body105 can include a single orifice that operates as both a fluid inlet 135and a fluid outlet 137. The fluid inlet 135 can be formed at a first endof the heat sink body 105 and the fluid outlet 137 can be formed at asecond, different end of the heat sink body 105. For example, the firstend can be an opposite or opposing end of the heat sink body 105 ascompared to the first end. The fluid inlet 155 and the fluid outlet 155can be formed at the same end or portion of the heat sink body 105.

The heat sink body 105 can include at least one sealing surface 140. Thesealing surface 140 can receive or engage with a surface (e.g., bottomsurface, top surface) of other components of an inverter module. Forexample, the sealing surface 140 can couple with a surface of acapacitor module of the inverter module. The sealing surface 140 canform a seal with the surface of the other components of an invertermodule that the heat sink module 100 is coupled with. The sealingsurface 140 can include a smooth surface to couple with other componentsof an inverter module that the heat sink module 100 is coupled with. Thesealing surface 140 can include a grooved surface to couple with othercomponents of an inverter module that the heat sink module 100 iscoupled with. For example, the sealing surface 140 can include one ormore ridges or a threaded surface to couple with a grooved surface ofanother component of the inverter module that the heat sink module 100is coupled with. The sealing surface 140 can correspond to a bottomsurface of the heat sink body 105, and thus the heat sink module 100.

The heat sink body 105 can include at least one joining surface 145. Thejoining surface 145 can receive or engage with a surface (e.g., bottomsurface, top surface) of an insulator plate of the heat sink module 100(e.g., insulator plate 130). The joining surface 145 can form a sealwith a surface of the insulator plate 130. For example, the joiningsurface 145 can form a seal with a bottom surface of the insulator plate130 to seal the cooling channel 130. The joining surface 145 can includea ribbed edge or shaped edge to form the seal with the bottom surface ofthe insulator plate 130. The heat sink body 105 can include a firstjoining surface 145 and a second joining surface 145. For example, andas depicted in FIG. 1, the first joining surface 145 can form an edge orlip of an outer wall or outer perimeter of the cooling channel 130. Thesecond joining surface 145 can form an edge or lip of an inner wall orinner perimeter of the cooling channel 130. Thus, the first and secondjoining surfaces 145 can seal the cooling channel 130 of the heat sinkbody 105 when the heat sink body 105 is coupled with the insulator plate130.

The heat sink module 100 can include at least one insulator plate 150.The insulator plate 150 can couple with the heat sink body 105 to sealthe cooling channel 130 and form a top surface of the cooling channel130. For example, the insulator plate 150 can be disposed on, coupledwith or in contact with the joining surfaces 145 of the heat sink body105 such that the insulator plate 150 seals the cooling channel 130 ofthe heat sink body 150. The insulator plate 150 can be disposed orarranged such that it can provide thermal dissipation to componentsdisposed about it, disposed above it, disposed below it, disposedadjacent to it, or disposed proximate to it. The insulator plate 150 canbe disposed between the heat sink body 105 and a heat sink lid (e.g.,heat sink lid 200 of the example of FIG. 2). The insulator plate 150 canhave a length in a range from 200 mm to 225 mm (e.g., 215 mm). A heightof the insulator plate 150 can range from 2 mm to 10 mm. A width of theinsulator plate 150 can range from 45 mm to 65 mm (e.g., 52 mm). Thelength, height, and width of the insulator plate 150 can vary within andoutside these ranges. The insulator plate 150 can include a variety ofdifferent materials, such as but not limited to, conductive material,metal material, metallic material or aluminum.

The insulator plate 150 can include at least one cooling surface 155.The cooling surface 155 can correspond to a top surface of the insulatorplate. The cooling surface 155 can correspond to a top surface of thecooling channel 130. The cooling surface 155 can include or have atemperate corresponding to a temperature of the coolant fluid within thecooling channel 130. The cooling surface 155 can have or include araised surface that extends into a bottom surface of an heat sink lid tocouple the insulator plate 150 with the heat sink lid (e.g., heat sinklid 200 as in the example of FIG. 2).

The insulator plate 150 can include at least one extended surface 160.The insulator plate 150 can include a single extended surface 160 ormultiple extended surfaces 160. The extended surfaces 160 can providecooling and thermal dissipation by providing more surface area for fluiddisposed within the cooling channel 130 to flow over or around and thusprovide a greater amount of cooling. For example, the extended surfaces160 can extend into the cooling channel 130 and interact with the fluid(e.g., coolant fluid) flowing through or disposed within the coolingchannels 130. The density, thickness, shape or dimensions of theextended surfaces 160 can be selected based at least in part ondimensions of the insulator plate 150 or the dimensions of the coolingchannel 150. The extended surfaces 160 can have a length in a range from5 mm to 10 mm (e.g., 6.5 mm). The extended surfaces 160 can have a widthin a range from 2 mm to 5 mm (e.g., 2.2 mm). The extended surfaces 160can have a height in a range from 2 mm to 15 mm (e.g., 3.7 mm). Thenumber of extended surfaces 160 coupled with or formed on the insulatorplate 150 can vary from 80 to 250. The length, width, and height of theextended surfaces 160 can vary within or outside these ranges. Thenumber of extended surfaces 160 coupled with or formed on the insulatorplate 150 can vary within or outside this range. The locating pins 165can have a length in a range from 5 mm to 10 mm (e.g., 6.5 mm). Thelocating pins 165 can have a width in a range from 2 mm to 5 mm (e.g.,2.2 mm). The locating pins 165 can have a height in a range from 2 mm to15 mm (e.g., 3.7 mm). The number of locating pins 165 coupled with orformed on the insulator plate 150 can vary from 80 to 250. The length,width, and height of the locating pins 165 can vary within or outsidethese ranges. The number of locating pins 165 coupled with or formed onthe insulator plate 150 can vary within or outside this range.

The insulator plate 150 can include at least one locating pin 165. Theinsulator plate 150 can include a single locating pin 165 or multiplelocating pins 165. For example, the insulator plate 150 can include aplurality of locating pins 165 (e.g., locating dowels) to position theinsulator plate 150 during a manufacturing process. The locating pins165 can be used, for example, during a pick and place automationprocess, to increase an efficiency of the manufacture process. Thelocating pins 165 can be used to reduce the amount of human interactionwith a particular manufacture process and therefore, the heat sinkmodule 100 can be formed using just the pick and place machinery and agrease dispenser device (or other form of fluid device). The locatingpins 165 can be used to position the insulator plate 150 between a heatsink lid (e.g., heat sink lid 200 as in the example of FIG. 2) and theheat sink body 105. The locating pins 165 can be coupled with, formedon, or disposed on a surface (e.g., top surface, bottom surface) of theinsulator plate 150. The locating pins 165 can have a variety ofdifferent shapes, such as but not limited to, a diamond shaped portion,rounded portion, octagonal shape, rectangular shape or square shape.

The insulator plate 150 can include an open inner region 170. The openinner region 170 can be arranged such that portions of other componentsof an invert module can be disposed within or through the open innerregion 170 to provide additional cooling to the respective components.For example, portions of a capacitor, such as but not limited to,positive terminals or leads and negative terminals or leads, can bedisposed within or extend through the open inner region 170. As the openinner region 170 of the insulator plate 150 can be disposed about,disposed around or otherwise surround the positive terminals or leadsand negative terminals or leads of the capacitor, the open inner region170 can provide active cooling to these components. The open innerregion 170, in additional to other cooling components of the heat sinkmodule 100, can reduce an inductance value of the inverter module andreduce EMI noise within the inverter module. For example, the design,shape, or geometry of the open inner region 170 can allow coolant fluiddisposed within the heat sink module 100 to be positioned adjacent to,proximate to or otherwise closer to the positive terminals or leads andnegative terminals or leads of the capacitor to provide active cooling.The width of the open inner region 170 can range from 10 mm to 20 mm(e.g., 12 mm). The length of the open inner region 170 can range from140 mm to 160 mm (e.g., 150 mm). The height of depth of the inner region170 can range from 3 mm to 15 mm (e.g., 4 mm, 8 mm). The width, length,or height of the open inner region 170 can vary within or outside theseranges.

FIG. 2, among others depicts a heat sink lid 200 of the heat sink module100. The heat sink lid 200 can couple with the insulator plate 130 andthe heat sink body 105 to form the heat sink module 100. The heat sinklid 200 can have a length in a range from 200 mm to 225 mm (e.g., 215mm). A height of the heat sink lid 200 can range from 5 mm to 15 mm(e.g., 10 mm). A width of the heat sink lid 200 can range from 50 mm to60 mm (e.g., 52 mm). The length, the height, or the width of the heatsink lid 200 can vary within or outside these ranges. The heat sink lid200 can include a variety of different materials, such as but notlimited to, conductive material, metal material, metallic material oraluminum.

The heat sink lid 200 can include a lid body 205. The lid body 205 canform the housing or outer surface of the heat sink lid 200. The lid body205 can include a variety of different materials, such as but notlimited to, conductive material, metal material, metallic material oraluminum. The lid body 205 can have a length in a range from 200 mm to225 mm (e.g., 215 mm). A height of the lid body 205 can range from 5 mmto 15 mm (e.g., 10 mm). A width of the lid body 205 can range from 50 mmto 60 mm (e.g., 52 mm). The length, the height, or the width of the lidbody 205 can vary within or outside these ranges.

The lid body 205 can include a plurality of connection points 210. Theconnection points 210 can be formed on one or more surfaces of the lidbody 205. For example, the connection points 210 can be formed on sidesurfaces of the lid body 205 to couple the lid body 205 with the heatsink body 105. The lid body 205 can include a single connection point210 or multiple connection points 210. For example, the lid body 205 caninclude a first plurality of connection points 210 formed on a firstside surface of the lid body 205 and a second plurality of connectionpoints 210 formed on a second side surface of the lid body 205. Thesecond side surface can be an opposite or opposing side surface ascompared to the first side surface. The number of connection points 210formed on the different surfaces of the lid body 205 can be selected tocorrespond to the number of connection points 210 formed oncorresponding surfaces of the heat sink body 105. For example, the lidbody 205 can have the same number of connection points 210 as the heatsink body 105. The connection points 210 can be formed from a variety ofdifferent materials, including but not limited to, plastic material ornon-conductive material.

The lid body 205 can include a plurality of mounting feet 215 (e.g.,mounting boss). The mounting feet 215 can include a variety of differentmaterials, including but not limited to, plastic material ornon-conductive material. The mounting feet 215 can couple with mountingholes or other forms of connection points of other components of aninverter module. For example, the mounting feet 215 can be arranged orpositioned along a surface (e.g., bottom surface, top surface) of thelid body 205. The mounting feet 215 can extend perpendicular withrespect to a surface (e.g., bottom surface, top surface) of the lid body205 to couple with corresponding mounting holes formed in the heat sinkbody 105. The mounting feet 215 can have a round shape, circular shape,octagonal shape, or rectangular shape. The mounting feet 215 can have athreaded outer surface to couple with a threaded inner surface of, forexample, mounting holes. The mounting feet 215 can have a smooth outersurface to couple with an inner surface of, for example, mounting holes.The mounting feet 215 can have a variety of different shapes, sizes ordimensions and the shape, size or dimensions of a particular mountingfeet 215 can be selected based at least in part on the dimensions of thelid body 205 or the heat sink body 105. The lid body 205 can include asingle mounting foot 215 or multiple mounting feet 215. For example, thenumber of mounting feet 215 can be selected to correspond to the numberof connection points or mounting holes on other components of theinverter module, such as but not limited to, the heat sink body 105. Forexample, the number of mounting feet 215 formed on the lid body 205 canbe the same as the number of mounting holes 120 formed on the heat sinkbody 105.

The lid body 205 can include a plurality of mounting holes 220. Themounting holes 220 can couple with, receive, engage, or secure the lidbody 205 with mating parts (e.g., mounting feet) or connection points onother components of an inverter module, for example, the heat sink body105 or a gel tray. The mounting holes 220 can couple with or secure atransistor locator (e.g., plastic IGBT locator) to the lid body 205 andthus, to the heat sink module 100 during a manufacture process. Forexample, the transistor locator can position one or more transistorswithin an inverter module and the transistor locator can be coupled withthe heat sink module 100 through one or more mounting holes 220 duringthe installation of the transistors.

The mounting holes 220 may include holes, orifices, or hollow portionsformed through one or more portions of the lid body 205. The mountingholes 220 can be formed completely though a portion of the lid body 205or may be formed up to a certain depth into a surface of the lid body205. The mounting holes 220 may include a threaded inner surface toreceive or engage a threaded outer surface of a fastener, screw, bolt,or mounting feet. The mounting holes 220 may include a threaded innersurface to receive or engage a threaded outer surface of a fastener,screw, bolt, or mounting feet. The mounting holes 220 can have a roundshape, circular shape, octagonal shape, or rectangular shape. Themounting holes 220 can have a variety of different shapes, sizes ordimensions and the shape, size or dimensions of a particular mountinghole 220 can be selected based at least in part on the dimensions of thelid body 205 or the heat sink body 105. The lid body 205 can include asingle mounting hole 220 or multiple mounting holes 220. For example,the number of mounting holes 220 can be selected to correspond to thenumber of connection points or mounting feet of other components of theinverter module, such as but not limited to, the heat sink body 105 or aplastic locator. For example, the number of mounting holes 220 formed onthe lid body 205 can be the same as the number of mounting feet orconnection points formed on a plastic locator of an inverter module.

The heat sink lid 200 can include an open inner region 225. For example,the lid body 205 can have a hollow middle portion or aperture formedthere through corresponding to the open inner region 225. The open innerregion 225 can be arranged such that portions of other components of aninverter module can be disposed within or through the open inner region225 to provide additional cooling to the respective components. Forexample, portions of a capacitor, such as but not limited to, positiveterminals or leads and negative terminals or leads, can be disposedwithin or extend through the open inner region 225. As the open innerregion 225 of the heat sink lid 205 can be disposed about, disposedaround or otherwise surround the positive terminals or leads andnegative terminals or leads of the capacitor, the open inner region 225can provide active cooling to these components. The open inner region225, in additional to other cooling components of the heat sink module100, can reduce an inductance value of the inverter module and reduceEMI noise within the inverter module. For example, the design, shape, orgeometry of the open inner region 225 can allow coolant fluid disposedwithin the heat sink module 100 to be positioned adjacent to, proximateto or otherwise closer to the positive terminals or leads and negativeterminals or leads of the capacitor to provide active cooling. The openinner region 225 can have a width in a range from 10 mm to 20 mm (e.g.,12 mm). The length of the open inner region 225 can range from 140 mm to160 mm (e.g., 150 mm). The height of depth of the inner region 225 canrange from 3 mm to 15 mm (e.g., 4 mm, 8 mm). The width, length, orheight of the open inner region 225 can vary within or outside theseranges. The open inner regions 125, 170, 225 for each for each of theheat sink body 105, the insulator plate 150, and lid body 205,respectively can have the same dimensions (e.g., width, length, height)or one or more of the open inner regions 125, 170, 225 of the heat sinkbody 105, the insulator plate 150, and lid body 205 can have one or moredifferent dimensions.

The heat sink lid 200 can include at least one locating dowel 230. Forexample, the lid body 205 can include a single locating dowel 230 ormultiple locating dowels 230. The locating dowels 230 can be used toposition the heat sink lid 200. The locating dowels 230 can be used, forexample, during a pick and place automation process, to increase anefficiency of the manufacture process. The locating dowels 230 can beused to reduce the amount of human interaction with a particularmanufacture process and therefore, the heat sink module 100 can beformed using just the pick and place machinery. The locating dowels 230can be used to position the heat sink lid 200 between a plurality oftransistors and the heat sink body 105 within an inverter module. Thelocating dowels 230 can be coupled with, formed on, or disposed on asurface (e.g., top surface, bottom surface) of the lid body 205. Thelocating dowels 230 can have a variety of different shapes, such as butnot limited to, a diamond shaped portion, rounded portion, octagonalshape, rectangular shape or square shape.

The heat sink lid 200 can include one or more recessed pockets to house,hold or disposed within a temperature sensor or temperature measuringdevice. For example, the temperature sensor can monitor or measure thetemperature of electrical components of an inverter module, such as butnot limited to, transistors, capacitors, or bus bars. The heat sink lid200 can use one or more of locating dowels 230 to position thetemperature sensor or temperature measuring device within the recessedpockets. For example, the locating dowels 230 can be formed on orcoupled with an inner surface of the lid body 205 and be arranged to aidin positioning the temperature sensor or temperature measuring devicewithin the recessed pockets.

The shape, geometry and dimensions of the heat sink module 100, and thusthat shape of each of the heat sink lid 200, the insulator plate 150,and the heat sink body 105, can be formed to surround, be disposedabout, or disposed around electrical components of an inverter module.The shape, geometry and dimensions of the heat sink module 100, and thusthat shape of each of the heat sink lid 200, the insulator plate 150,and the heat sink body 105, can be optimized to create more surface areaand provide greater cooling within an inverter module. For example, theheat sink module 100 can be disposed within an inverter module such thatthe heat sink lid 200, the insulator plate 150, and the heat sink body105 surround, be disposed about, or disposed around positive terminalsor leads of a capacitor coupled with transistors and negative terminalsor leads of a capacitor coupled with transistors in an inverter module.The positive terminals or leads of the capacitor and the negativeterminals or leads of the capacitor can extend through the open innerregions 225, 170, 125 of each of the heat sink lid 200, the insulatorplate 150, and the heat sink body 105, respectively to position coolsurfaces and coolant flowing through the heat sink module 100 closer tothese electrical components. Thus, the heat sink lid 200, the insulatorplate 150, and the heat sink body 105 can provide active cooling to eachof the positive terminals or leads of a capacitor coupled withtransistors and negative terminals or leads of a capacitor coupled withtransistors in an inverter module to reduce inductance value in theinverter module and reduce EMI noise in the inverter module.

FIG. 3, among others, depicts a cross-sectional view of a power module300. The power module 300 can include a heat sink module 100 to provideactive cooling to a capacitor (e.g., capacitor 305) and transistors(e.g., transistors 315) of the power module. The power module 300 can beone power module of a multiple phase inverter module (e.g., invertermodule 450 as in the example of FIG. 4) disposed within a drive trainunit of an electric vehicle (e.g., electric vehicle 405 as in theexample of FIG. 4) to power the respective electric vehicle. Forexample, the power module 300 can couple with two other power modules300 in a triplet configuration to form a three-phase inverter module(e.g., inverter module 450 as in the example of FIG. 4). Each of thepower modules 300 can be formed having the same components anddimensions to provide inverter functionality based at least in part onthe modular design (e.g., ease of assembly) and ability to be adaptedfor a variety of different inverter applications. The power module 300can be formed having a length in a range from 220 mm to 230 mm. Thepower module 300 can be formed having a width in a range from 80 mm to90 mm. The power module 300 can be formed having a height in a rangefrom 60 mm to 70 mm. The dimensions and size of the power modules 300described herein can vary outside these ranges.

As depicted in FIG. 3, the power module 300 can include at least onecapacitor module 305 having a first surface (e.g., top surface) and asecond surface (e.g., bottom surface). The capacitor module 305 caninclude DC-Link, Single-Phase Capacitors (“DCLSP Capacitors”) used as Xcapacitors, DC-Link filtering capacitors or automotive, industrial, orcommercial inverters. The capacitor module 305 can include a housing orouter surface that can be formed from a variety of different materials,including but not limited to, plastic material or non-conductivematerial. The dimensions of the capacitor module 305 can vary and can beselected based at least in part on the dimensions of the power module300. For example, the capacitor module 305 can have a length in a rangefrom 140 mm to 155 mm (e.g., 150 mm). The capacitor module 305 can havea width in a range from 60 mm to 70 mm (e.g., 66 mm). The capacitormodule 305 can have a height in a range from 30 mm to 40 mm (e.g., 32mm).

The capacitor module 305 can include terminals 306, 307 and a divider308. The terminals 306, 307 can include positive terminals 306 andnegative terminals 307. For example, positive terminals 306 can extendfrom or be coupled with a first side surface of the divider 308 andnegative terminals 307 can extend from or be coupled with a second sidesurface of the divider 308. Thus, the divider 308 can be disposed orotherwise positioned to separate the positive terminals 306 from thenegative terminals 307 of the capacitor module 305. The capacitor module305 can include one or more capacitor elements (not shown) disposedwithin the capacitor module 305. For example, the capacitor module 305can house a single capacitor film roll or multiple capacitor film rolls(e.g., three to four capacitor film rolls). The capacitor film rolls canbe coupled with the positive terminals 306 and the negative terminals307 through one or more tabs. The capacitor film rolls and thus thecapacitor module 305 can have a capacitance value of 200-400 nanofarads(nF), e.g., 300 nF. The capacitance value can vary within or outsidethis range.

The positive terminals 306 can correspond to leads or terminals of apositive bus bar of the capacitor module 305. The negative terminals 307can correspond to leads or terminals of a negative bus bar of thecapacitor module 305. For example, the capacitor module 305 can includea positive bus bar and a negative bus bar, for example, disposed withinthe housing of the capacitor module 305. The positive terminals 306 caninclude leads, terminals or extensions of the positive bus bar thatextend out of the capacitor module 305 to couple with leads of othercomponents of the power module 300, such as but not limited to,transistors (e.g., leads 320 of transistors 315) of the power module300. The negative terminals 307 can include leads, terminals orextensions of the negative bus bar that extend out of the capacitormodule 305 to couple with leads of other components of the power module300, such as but not limited to, transistors (e.g., leads 320 oftransistors 315) of the power module 300.

The divider 308 can be disposed between the positive terminals 306 andthe negative terminals 307 to electrically isolate or electricallyinsulate the positive terminals 306 and the negative terminals 307. Theshape and dimensions of the divider 308 can vary and can be selectedbased at least in part on the shape and dimensions of the positiveterminals 306 and the negative terminals 307. For example, a thicknessor width of the divider 308 can be in a range from 0.5 mm to 1.5 mm. Alength of the divider 308 can be in a range from 130 mm to 145 mm (e.g.,140 mm). A height of the divider 308 can be in a range from 20 mm to 30mm (e.g., 25 mm). The thickness, width, length or height of the divider308 can vary within or outside these ranges.

The power module 300 can include at least one heat sink module 100. Theheat sink module 100 can include a first surface (e.g., top surface) anda second surface (e.g., bottom surface). The second surface of the heatsink module 100 can be coupled with, disposed over or otherwise incontact with the first surface of the capacitor module 305. For example,the positive terminals 306, the negative terminals 307, and the divider308 can extend through an inner open region 125 of the heat sink module100. The heat sink module 100 can provide active cooling to thecapacitor module 305. For example, the heat sink module 100 can bedisposed proximate to at least one surface, here the first surface(e.g., top surface) of the capacitor module 305 and the heat sink module100 can provide active cooling to the first surface of the capacitormodule 305. For example, the heat sink module 100 can have a shape thatdefines one or more cooling channels 130 formed within the heat sinkmodule 100. The cooling channels 130 can receive and be shaped to allowcoolant to flow through the heat sink module 100 such that the heat sinkmodule 100 can provide active cooling to components and electronics(e.g., capacitor module 305, transistors 315) disposed proximate tosurfaces of the heat sink module 100.

The heat sink module 100 can be disposed within the power module 300such that the heat sink module 100 surrounds, is disposed about, ordisposed around a portion of terminals 306, 307 of the capacitor module305 that couple with transistors (e.g., transistors 315) of the powermodule 300. For example, the heat sink module 100 can include an openinner region 125 (e.g., hole, orifice) formed in a middle portion of theheat sink module 100. The capacitor module 305 can couple with the heatsink module 100 such that the divider 308, positive terminals 306, andnegative terminals 307 extend through the open inner region 125 of theheat sink module 100. Thus, the heat sink module 100 can be positionedsuch that it surrounds surfaces of the divider 308, positive terminals306, and negative terminals 307 to provide active cooling to the divider308, positive terminals 306, negative terminals 307, and transistors315. For example, in operation, the capacitor module 305 can generateheat and may not receive enough cooling (e.g., passive cooling, activecooling). The heat generation inside the capacitor module 305 can reducethe life of the respective capacitor module 305 if not properlydissipated. Thus, the heat sink module 100 can provide active cooling orpassive cooling to enable the respective capacitor module 305 todissipate the heat generated by the capacitor module 305. For example,the heat sink module 100 can be positioned such that cool surfaces andcoolant flowing through the heat sink module 100 are disposed closer tothese electrical components, for example, the capacitor module 100 andtransistors 315. Thus, the heat sink module 100 can provide activecooling to each of the capacitor module 305, the positive terminals 306,the negative terminals 307 and transistors 315 of the power module 300to reduce inductance value in the power module 300 and reduce EMI noisein the inverter module. The heat sink open inner region 125 can have awidth in a range from 10 mm to 20 mm (e.g., 12 mm). The heat sink openinner region 125 can have a length in a range from 140 mm to 120 mm(e.g., 150 mm). The heat sink open inner region 125 can have a height(or depth) in a range from 3 mm to 15 mm (e.g., 4 mm, 8 mm). The width,length, or height of the heat sink open inner region 125 can vary withinor outside these ranges.

The power module 300 can include one or more ceramic plates 310 coupledto, disposed over or otherwise in contact with the first surface of theheat sink module 100. For example, and as depicted in FIG. 3, the powermodule 300 can include first and second ceramic plates 310. Each of thefirst and second ceramic plates 310 can include a first surface (e.g.,top surface) and a second surface (e.g., bottom surface). Each of thesecond surfaces of the first and second ceramic plates 310 can couplewith, be disposed over or otherwise in contact with the first surface ofthe heat sink module 100. The ceramic plates 310 can insulate the heatsink module 100 from one or transistors (e.g., transistors 315) disposedwithin the power module 300. The ceramic plates 310 may include ceramicbased material and can electrically insulate the heat sink module 100from transistors (e.g., transistors 315) disposed within the powermodule 300. For example, the ceramic plates 310 can prevent a shortcircuit condition between the heat sink module 100 and the transistors(e.g., transistors 315) disposed within the power module 300. Theceramic plates 310 can have a length in a range from 100 mm to 250 mm.The ceramic plates 310 can have a width in a range from 40 mm to 55 mm.The ceramic plates 310 have a height (or thickness) in a range from 2 mmto 10 mm. The length, width, and height of the ceramic plates 310 canvary within or outside these ranges.

The power module 300 can include a plurality of transistors 315. Theplurality of transistors 315 can couple with, be disposed over orotherwise in contact with the first surface of the ceramic plates 310.Each of the transistors 315 can include a plurality of leads 320. Thetransistors 315 can include discrete insulated-gate bipolar transistors(IGBT's), IGBT semiconductor dies, TO-247 transistors, or TO-247discreet IGBT packages (e.g., TO-247 transistors, switches). Each of thetransistors 315 can include one or more leads 320. For example, each ofthe transistors 315 may include three leads 320. Each of the three leads320 can corresponds to at least one of the terminals of the transistor315. For example, a first lead 320 can correspond to the base terminalor base lead. A second lead 320 can correspond to the collector terminalor collector lead. A third lead 320 can correspond to the emitterterminal or emitter lead. The leads 320 can have a generally straight orunbent shape. When the transistors 315 are fully coupled within thepower module 300, the leads 320 can be bent, shaped or otherwisemanipulated to couple with a respective one or more components (e.g.,gate drive printed circuit board (PCB) 350, capacitor module 100) withinthe power module 300. For example, the leads 320 can be formed such thatthey extend perpendicular with respect to a first surface (e.g., topsurface) of the transistors 315. For example, the leads 320 can beformed such that they have a bent shape and extend up with respect to afirst surface (e.g., top surface) of the transistors 315.

The plurality of transistors 315 can be organized in a predeterminedarrangement. For example, the plurality of transistors 315 can bedisposed in one or more rows having multiple transistors 315 and therows can be disposed such that the leads 320 of each of the transistors315 are proximate to or adjacent to each other to allow for ease ofcoupling with components (e.g., gate drive PCB 160) of the power module300. For example, a first plurality of transistors 315 can be arrangedin a first row and a second plurality of transistors 315 can be arrangedin a second row. Each of the rows of transistors 315 may include thesame number of transistors or the rows of transistors 315 may include adifferent number of transistors 315. The transistors 315 in the same rowcan be positioned such that one or more side edges are in contact with aside edge of a single transistor 315 or two transistors 315 of the samerow (e.g., one transistor 315 on each side). Thus, the transistors 315can be arranged in a uniformed row along the first surface of theceramic plates 310. The first plurality of transistors 315 can be spacedfrom the second plurality of transistors 315. The first plurality oftransistors 315 can be evenly spaced or symmetrically from the secondplurality of transistors 315 with respect to the first surface of theceramic plates 310. For example, each of the transistors 315 in thefirst plurality of transistors 315 can be spaced the same distance froma corresponding transistor 315 of the second plurality of transistors315. The first plurality of transistors 315 can be asymmetrically spacedfrom the second plurality of transistors 315 with respect to the firstsurface of the ceramic plates 310. For example, one or more of thetransistors 315 in the first plurality of transistors 315 can be spaceddifferent distances from corresponding transistors 315 of the secondplurality of transistors 315. The one or more of the transistors 315 inthe first plurality of transistors 315 can be spaced with respect toeach other with a pitch (e.g., center to center spacing) in a range from15 mm to 20 mm (e.g., 17.5 mm). The one or more of the transistors 315in the second plurality of transistors 315 can be spaced with respect toeach other with a pitch (e.g., center to center spacing) in a range from15 mm to 20 mm (e.g., 17.5 mm). The one or more of the transistors 315in the first plurality of transistors 315 can be spaced with respect tothe one or more transistors 315 in the second plurality of transistors315 in a range from 10 mm to 20 mm (e.g., 14 mm).

The power module 300 can include at least one temperature sensor 325such as at least one transistor temperature sensing printed circuitboard (PCB) 325. The transistor temperature sensing PCB 325 can includecontrol electronics to communicate or monitor temperatures of differentcomponents of the power module 300, such as but not limited totransistors 315. For example, the transistor temperature sensing PCB 325can be disposed proximate to the plurality of transistors 315 to providetemperature data corresponding to the plurality of transistors 315. Forexample, the transistor temperature sensing PCB 325 can be disposedbetween the ceramic plates 310 and the plurality of transistors 315 orbetween the heat sink 305 and the ceramic plates 310. The transistortemperature sensing PCB 325 can collect or retrieve temperature datacorresponding to the plurality of transistors 315. The transistortemperature sensing PCB 325 can collect or retrieve temperature datacorresponding to individual transistors 315, groups of transistors 315or all of the plurality of transistors 315 collectively. For example,the temperature sensing can be extrapolated to predict IGBT junctiontemperatures. The transistor temperature sensing PCB 325 may bepositioned such that it is compressed and sealed against a pocket ofgrease on the ceramic, adjacent to the transistors 315. For example, thetransistor temperature sensing PCB 325 can be disposed a distance fromthe transistors 315 that ranges from 0 mm (e.g., in contact) to 2 mm.The distance between the transistor temperature sensing PCB 325 can varyoutside these ranges.

The power module 300 can include a locator 330 (which can also bereferred to herein as a locator guide or locator frame). The locator 330can include a first surface (e.g., top surface) and a second surface(e.g., bottom surface). The second surface of the locator 330 can couplewith, be disposed over or in contact with the first surface of theceramic plates 310 or the heat sink 305. The locator 330 can includenon-conductive material or plastic material. The locator 330 can have alength in a range from 200 mm to 225 mm (e.g., 215 mm). The locator 330can have a height (e.g., thickness) in a range from 5 mm to 20 mm (e.g.,10 mm). The locator 330 can have a width in a range from 45 mm to 65 mm(e.g., 52 mm). The length, height, and width of the locator 330 can varywithin and outside these ranges. The locator 330 can includes aplurality of slots 332 (e.g., apertures, holes, recesses) formed in aframe of the locator 330 to hold or couple various components of thepower module 300 in place. The locator 330 can include the plurality ofslots 332 to hold or couple with the transistors 315. At least ontransistor 315 of the plurality of transistors 315 can be disposed orcoupled with at least one slot 332 of the locator 330.

A plurality of clips 335 can couple the transistors 315 with the locator330 (e.g., hold the transistors 315 in the slots 332 of the locator330). For example, each of the plurality of transistors 315 can bedisposed within at least one slot 332 of the locator 330 and the clips335 can include spring clips that couple onto a side portion of thelocator 330 and the transistors 315 to hold or compress the transistors315 within a respective slot 332 to hold the transistors 315 in placeand in contact with the locator 330. Fasteners 357 may be used to couplethe transistors 315 with the locator 330. The locator 330 can include aplastic locator or plastic material.

The slots 332 of the locator 330 can include apertures, holes, recessesformed in a frame of the locator 330. The slots 332 can have varyingshapes, sizes and dimensions and the shapes, sizes and dimensions of aparticular slot 332 can be selected based at least in part on the shape,size or dimension of a component of the power module 300. For example,the locator 330 may include slots 332 for transistors 315, fasteners,clips, thermistors or thermal pads. The transistors slots have agenerally rectangular shape which can be selected based on theparticular transistor 315 to be used in the power module 300. Thefastener slots can have a generally round shape and may include athreaded inner surface to couple with a threaded portion of a fastener.The thermistor slots can have a generally round shape. The power module300 may include only one thermistor, thus only one thermistor slot maybe used. However, two thermistor slots can be formed to providedsymmetry and ease of manufacture. For example, having two thermistorslots can allow for the locator 330 to be rotated and a thermistor ofthe power module 300 can be disposed within either thermistor slot. Thelocator 330 can be formed having any number of slots 332, and the numberof slots 332 can be selected based at least on the type of components ofthe power module 300. For example, the total number of slots 332 formedin the locator 330 can range from eight slots 332 to twenty four slots332.

The locator 330 can operate as a guide or frame for a manufactureprocess of the power module 300, such as during a pick and placeautomation process, to increase an efficiency of the manufactureprocess. For example, the locator 330 can keep different components orparts of the power module 300 from moving around during manufactureresulting in a reducing an amount of fixturing (e.g., identifying andmoving parts to correct locations) during the manufacture process. Thepower module 300 can be formed faster and more efficiently using thelocator 330 as a guide for an automation device (e.g., pick and placeautomation machinery). The locator 330 can reduce the amount of humaninteraction with a particular manufacture process and therefore, thepower module 300 can be formed using just the pick and place machineryand a grease dispenser device (or other form of fluid device).

The power module 300 can include a laminated bus bar 340. The laminatedbus bar 340 can include a first surface (e.g., top surface) and a secondsurface (e.g., bottom surface). The second surface of the laminated busbar 340 can couple with, be disposed over or in contact with the firstsurface of the locator 330 and portions of the first surface of thetransistors 315 disposed in the slots 332 of the locator 330. The leads320 of the transistors 315 can couple with portions of the laminated busbar 340. For example, the laminated bus bar 340 can include a pluralityof leads 347. Each of the plurality of leads 347 of the laminated busbar 340 can couple with at least one lead 320 of the plurality oftransistors 315. For example, at least two leads 345 of the laminatedbus bar 340 can couple with at least two leads 320 of a transistor 315of the plurality of transistors 315. The laminated bus bar 340 can havea length in a range from 200 mm to 225 mm. The laminated bus bar 340 canhave a height (e.g., thickness) in a range from 5 mm to 20 mm. Thelaminated bus bar 340 can have a width in a range from 45 mm to 65 mm.The length, height, and width of the laminated bus bar 340 can varywithin and outside these ranges. The laminated bus bar 340 can includeor conductive material, such as but not limited to copper.

The laminated bus bar 340 can include includes two input terminals 342,344 (e.g., positive input terminal and negative input terminal) disposedat or along a first side and an output terminal 345 disposed at asecond, different side of the laminated bus bar 340. For example, thetwo input terminals 342, 344 can be disposed at an opposite or opposingside as compared to the output terminal 345. The first and second inputterminals 342, 344 can include conductive material, such as but notlimited to copper. The first and second input terminals 342, 344 can beformed in a variety of different shapes to accommodate coupling with aninverter bus bar (e.g., positive bus bar, negative bus bar). The firstand second input terminals 342, 344 can have or include a straightshape, or a curved or bent shape. For example, the first and secondinput terminals 342, 344 can include a first portion that is parallelwith respect to a first surface (e.g., top surface) of the laminated busbar 340 and a second portion that is perpendicular with respect to thefirst surface of the laminated bus bar 340. The first input terminal 342can couple with a positive inverter bus-bar (not shown) to receive apositive voltage and provide the positive voltage to the power module300. The second input terminal 344 can couple with a negative bus-bar(not shown) to receive a negative voltage and provide the negativevoltage to the power module 300. The first input terminal 342 can bedisposed at a different level or height with respect to the side surfaceof the laminated bus bar 340 as compared with the second input terminal344. For example, the first input terminal 342 can be disposed at firstlevel or first height and the second input terminal 344 can be disposedat a second level or second height. The first level or first height canbe greater than the second level or the second height. The first levelor first height can be less than the second level or the second height.

The output terminal 345 can include conductive material, such as but notlimited to copper. The output terminal 345 can be formed in a variety ofdifferent shapes to accommodate coupling with an inverter phase bus bar(not shown). The output terminal 345 can be formed having a straightshape, or a curved or bent shape. For example, the output terminal 345can include a first portion that is parallel with respect to a firstsurface (e.g., top surface) of the laminated bus bar 340 and a secondportion that is perpendicular with respect to the first surface of thelaminated bus bar 340. The output terminal 345 can couple with a phasebus-bar (not shown) to provide power generated by the power module 300to other electrical components of an electric vehicle.

The power module 300 can include a gate drive printed circuit board(PCB) 350. The gate drive PCB 350 can include a first surface (e.g., topsurface) and a second surface (e.g., bottom surface). The second surfaceof gate drive PCB 350 can couple with, be disposed over or in contactwith the first surface of the laminated bus bar 340. The gate drive PCB350 can include control electronics to control one or more components ofthe power module 300 or communication electronics to communicate withand receive from or transmit signals to a control board of an invertermodule. The gate drive PCB 350 can include control electronics and cangenerate and provide control signals to the transistors 315. Forexample, the leads 320 of the transistors 315 can extend through thelocator 330 and the laminated bus bar 340 to couple with a portion orsurface of the gate drive PCB 350. The gate drive PCB 350 can generatecontrol signals, for example, to turn one or more of transistors 315 onor off, open or close. The gate drive PCB 350 can have a length in arange from 140 mm to 220 mm. The gate drive PCB 350 can have a height(e.g., thickness) in a range from 5 mm to 10 mm. The gate drive PCB 350can have a width in a range from 60 mm to 100 mm. The length, height,and width of the gate drive PCB 350 can vary within and outside theseranges.

The power module 300 can include a dielectric gel tray 355. Thedielectric gel tray 355 can include a first surface (e.g., top surface),a second surface (e.g., bottom surface) and can define an inner regionthat includes the second surface. The second surface of the dielectricgel tray 355 can couple with, be disposed over or contact the gate drivePCB 350. The dielectric gel tray 355 can couple with the capacitormodule 100 though one or more fasteners 357. For example, the dielectricgel tray 355 can form a housing that is disposed over the gate drive PCB350, laminated bus bar 340, locator 330, transistors 315, transistortemperature sensing PCB 325, the ceramic plates 310, the heat sink 305such that that each of the gate drive PCB 350, laminated bus bar 340,locator 330, transistors 315, transistor temperature sensing PCB 325,the ceramic plates 310, and the heat sink 305 are disposed within theinner region defined by the dielectric gel tray 355 and thus covered bythe dielectric gel tray 355 when the dielectric gel tray 355 is coupledwith the capacitor module 100. For example, the dielectric gel tray 355can include or be formed having an inner region that covers, submerges,or can be disposed about multiple components of the power module 300.

The dielectric gel tray 355 (e.g., potting compound container) caninclude poly carbon material, or other forms of high temperatureplastic. The dielectric gel tray 355 can be formed using variousinjection molded techniques. The dielectric gel tray 355 can be disposedover one or more components of the power module 300 and operate as aninsulator for the components (e.g., electronics) of the power module300. The gel tray 355 can be formed having a length in a range from 160mm to 240 mm. The gel tray 355 can be formed having a width in a rangefrom 80 mm to 90 mm. The gel tray 355 can be formed having a height in arange from 40 mm to 60 mm. The dimensions and size of the gel tray 355can vary within or outside these ranges.

The gel tray 355 includes one or more capacitive orifices 360. Thecapacitive orifices 360 can be used as inputs or outputs for the powermodule 300. For example, the capacitive orifices 360 can be formed as ahole or an access point to couple a power supply (e.g., DC power supply)to the power module 300. The gel tray 355 can include a first capacitiveorifice 360 that couples the first input terminal 342 of the laminatedbus bar 340 with a positive bus bar to provide a positive power supplyto the power module 300. The gel tray 355 can include a secondcapacitive orifice 360 that couples the second input terminal 344 of thelaminated bus bar 340 with a negative bus bar to provide a negativepower supply to the power module 300. The gel tray 355 can include athird capacitive orifice 360 that couples the output terminal 345 of thelaminated bus bar 340 with a phase bus bar to provide an output voltagegenerated by the power module 300 to other components of an electricvehicle. For example, capacitive orifices 360 can be formed as a hole oran access point to provide a power (e.g., voltage) generated by thepower module 300 to other systems, such as a drive train unit of anelectric vehicle.

FIG. 4 depicts an example cross-section view 400 of an electric vehicle405 installed with a battery pack 410. The battery pack 410 can includean inverter module 450 having one or more power modules 300. Each of thepower modules 300 can include at least one heat sink module 100 toprovide cooling to electrical components within the respective powermodules 300. For example, the inverter module 450 can include a threesingle phase power modules 300 each having at least one heat sink module100 to form a three phase inverter module 450. The inverter module 450can provide three phase power generated by the three power modules 300to power the electric vehicle 405. The battery pack 410 can correspondto a drive train unit 410 of the electric vehicle 405. For example, thebattery pack 410 can be disposed within or be a component of a drivetrain unit 410. The drive train unit 410 (and the battery pack 410) canprovide power to the electric vehicle 405. For example, the drive trainunit 410 may include components of the electric vehicle 405 thatgenerate or provide power to drive the wheels or move the electricvehicle 405. The drive train unit 410 can be a component of an electricvehicle drive system. The electric vehicle drive system can transmit orprovide power to different components of the electric vehicle 405. Forexample, the electric vehicle drive train system can transmit power fromthe battery pack 410 or drive train unit 410 to an axle or wheels of theelectric vehicle 405.

The electric vehicle 405 can include an autonomous, semi-autonomous, ornon-autonomous human operated vehicle. The electric vehicle 405 caninclude a hybrid vehicle that operates from on-board electric sourcesand from gasoline or other power sources. The electric vehicle 405 caninclude automobiles, cars, trucks, passenger vehicles, industrialvehicles, motorcycles, and other transport vehicles. The electricvehicle 405 can include a chassis 415 (e.g., a frame, internal frame, orsupport structure). The chassis 415 can support various components ofthe electric vehicle 405. The chassis 415 can span a front portion 420(e.g., a hood or bonnet portion), a body portion 425, and a rear portion430 (e.g., a trunk portion) of the electric vehicle 405. The frontportion 420 can include the portion of the electric vehicle 405 from thefront bumper to the front wheel well of the electric vehicle 405. Thebody portion 425 can include the portion of the electric vehicle 405from the front wheel well to the back wheel well of the electric vehicle405. The rear portion 430 can include the portion of the electricvehicle 405 from the back wheel well to the back bumper of the electricvehicle 405.

The battery pack 410 that includes at least one power module 300 havingat least one heat sink module 100 can be installed or placed within theelectric vehicle 405. The battery pack 410 can include or couple with apower converter component. For example, the power converter componentcan include the inverter module 400 having three phase power module 405.The battery pack 410 can be installed on the chassis 415 of the electricvehicle 405 within the front portion 420, the body portion 425 (asdepicted in FIG. 4), or the rear portion 430. The battery pack 410 cancouple with a first bus-bar 435 and a second bus-bar 440 that areconnected or otherwise electrically coupled with other electricalcomponents of the electric vehicle 405 to provide electrical power fromthe battery pack 410. For example, each of the power modules 300 cancouple with the first bus-bar 435 and the second bus bar 440 to provideelectrical power from the battery pack 410 to other electricalcomponents of the electric vehicle 405.

FIG. 5, among others, depicts a method 500 for providing a heat sinkmodule 100 of an inverter module 450 to power an electric vehicle 405.For example, at least one heat sink module 100 can be disposed withineach power module 300 that are coupled together to form the invertermodule 450. The method 500 can include providing a heat sink body 105(ACT 505). For example, the method 500 can include providing a heat sinkbody 105 of a heat sink module 100. The heat sink body 105 can be formedusing materials, such as but not limited to, conductive material, metalmaterial, metallic material or aluminum. The heat sink body 105 can formthe base of the heat sink module 100. For example, providing the heatsink body 105 can include forming one or more mounting feet 115 on asecond surface (e.g., bottom surface) of the heat sink body 105. Themounting feet 115 can couple with other components of a power module300, such as but not limited to, a capacitor module. The heat sink body105 can be formed having a plurality of connection points 110. Theconnection points 110 can be formed on an outer surface of the heat sinkbody 105. The connection points 110 can be formed on side surfaces ofthe heat sink body 105 to couple the lid body 205 with the connectionpoints 210 formed on the lid body 205.

The method 500 can include forming mounting holes 120 (ACT 510). Forexample, the method 500 can include forming a plurality of mountingholes 120, a fluid inlet 135 and a fluid outlet 135 in the heat sinkbody 105. One or more holes, orifices, or apertures can be formed on theheat sink body 105 to form the mounting holes 120. The mounting holes120 can be formed completely though a portion of the heat sink body 105or may be formed up to a certain depth into a surface of the heat sinkbody 105. The mounting holes 120 can be formed having a threaded innersurface to receive or engage a threaded outer surface of a fastener,screw, bolt, or mounting feet. For example, the mounting holes 120 cancouple with, receive, engage, or secure the heat sink body 105 withmating parts (e.g., mounting feet) or connection points on othercomponents of an inverter module, for example, of a heat sink lid 200.At least one fluid inlet 135 can be formed in the heat sink body 105.For example, an orifice can be formed through a surface of the heat sinkbody 105 to receive or provide fluids to one or more cooling channels130. The heat sink body 105 can include a single fluid inlet 135 ormultiple fluid inlets 135. At least one fluid outlet 135 can be formedin the heat sink body 105. For example, an orifice can be formed througha surface of the heat sink body 105 to release or discharge fluids fromone or more cooling channels 130. The heat sink body 105 can include asingle fluid outlet 135 or multiple fluid outlets 135. The heat sinkbody 105 may include one orifice that operates as both a fluid inlet 135and a fluid outlet 135.

The method 500 can include forming cooling channels 130 (ACT 515). Forexample, the method 500 can include forming one or more cooling channels130 in the heat sink body 105. The cooling channels 130 can be fluidlycoupled with the fluid inlet 135 and the fluid outlet 135. The coolingchannel 130 can form an interior of the heat sink body 105. For example,the cooling channel 130 can be formed by creating a hollow region withinthe heat sink body 105. The heat sink body 105 can be formed having a“U” shape or oval shape and the cooling channel 130 can correspond to aninterior region of the “U” shaped or oval shaped heat sink body 105. Thecooling channel 130 can be formed such that it extends a length of theheat sink body 105. The cooling channel 130 can hold or contain fluid,such as coolant, to provide active cooling to other components of aninverter module, such as but not limited to, a capacitor or transistors.

Forming cooling channels 130 can include forming a single coolingchannel 130 or forming multiple cooling channels 130 (e.g., two or morecooling channels 130). For example, a first cooling channel 130 can beformed and a second cooling channel 130 can be formed. Forming coolingchannels 130 can include fluidly coupling the first cooling channel 130with the second cooling channel 130 such that the first cooling channel130 and the second cooling channel 130 form one cooling channel andrefer to portions or regions of the single cooling channel 130 aredisposed parallel with respect to each other. The cooling channel 130 orcooling channels 130 can be fluidly coupled with the fluid inlet 135 toreceive fluid, such as, but not limited to, coolant fluid. The coolingchannel 130 or cooling channels 130 can be fluidly coupled with thefluid outlet 135 to release or discharge fluid, such as, but not limitedto, coolant fluid.

The method 500 can include coupling an insulator plate 150 (ACT 520).For example, the method 500 can include coupling an insulator plate 150with the heat sink body 105. The insulator plate 150 can have a firstsurface and a second surface. The first surface can correspond to acooling surface 155. The second surface of the insulator plate 150 cancouple with a joining surface 145 of the heat sink body 105 and seal theone or more cooling channels 130. The insulator 150 can be disposed overthe joining surface 145 of the heat sink body to couple the insulator150 with the heat sink body 105. The insulator plate 150 can correspondto a top surface of the cooling channel 130. Coupling an insulator plate150 can include forming at least one locating pin 165 on the insulatorplate 150. For example, a single locating pin 165 or multiple locatingpins 165 can be formed on the insulator plate 150 to aid in amanufacturing process of the heat sink module 100. The insulator plate150 can couple with a locator during, for example, a pick and placeautomation process, using the locating pin 165. The locator can use thelocating pin 165 to position the insulator plate 150 during themanufacturing process. The locating pins 165 can be used to position theinsulator plate 150 between a heat sink lid (e.g., heat sink lid 200 asin the example of FIG. 2) and the heat sink body 105. The locating pins165 can be coupled with, formed on, or disposed on a surface (e.g., topsurface, bottom surface) of the insulator plate 150.

The method 500 can include disposing a lid 200 (ACT 525). For example,the method 500 can include disposing a heat sink lid 200 over the firstsurface of the insulator plate 150. The heat sink lid 200 can include aplurality of mounting feet 215 to couple with the mounting holes 120 ofthe heat sink body 105 to secure the heat sink lid 200 to the heat sinkbody 105. The heat sink lid 200 can be formed using materials, such asbut not limited to, conductive material, metal material, metallicmaterial or aluminum. The heat sink lid 200 can be formed having a lidbody 205. The lid body 205 can form the housing or outer surface of theheat sink lid 200. The lid body 205 can include a plurality ofconnection points 210. For example, disposing a lid 200 can includeforming a plurality of connection points 210 on an outer surface of theheat sink lid 200 and forming a plurality of connection points 110 on anouter surface of the heat sink body 105. The connection points 210 canbe formed on side surfaces of the lid body 205 to couple the lid body205 with the connection points 110 formed on the heat sink body 105.

Disposing a lid 200 can include forming a plurality of mounting feet 215(e.g., mounting boss). The mounting feet 215 can be formed frommaterials, including but not limited to, plastic material ornon-conductive material. The mounting feet 215 can couple with mountingholes or other forms of connection points of other components of aninverter module. For example, the mounting feet 215 can be formedextending perpendicular with respect to a surface (e.g., bottom surface,top surface) of the lid body 205 to couple with corresponding mountingholes formed in the heat sink body 105. Disposing a lid 200 can includeforming a plurality of mounting holes 220 on the lid body 205. Themounting holes 220 can couple with, receive, engage, or secure the lidbody 205 with mating parts (e.g., mounting feet) or connection points onother components of an inverter module, for example, the heat sink body105 or a gel tray. Disposing a lid 200 can include forming at least onelocating dowel 230 (or locating pin) on the lid body 205. For example,the lid body 205 can include a single locating dowel 230 or multiplelocating dowels 230. The locating dowels 230 can be used to position theheat sink lid 200 during a pick and place automation process, toincrease an efficiency of the manufacture process. The locating dowels230 can be used to reduce the amount of human interaction with aparticular manufacture process and therefore, the heat sink module 100can be formed using just the pick and place machinery. The locatingdowels 230 can be used to position the heat sink lid 200 between aplurality of transistors and the heat sink body 105 within an invertermodule. The locating dowels 230 can be coupled with, formed on, ordisposed on a surface (e.g., top surface, bottom surface) of the lidbody 205. The locating dowels 230 can have a variety of differentshapes, such as but not limited to, a diamond shaped portion, roundedportion, octagonal shape, rectangular shape or square shape.

The heat sink module 100 can be formed in a top down fashion. Forexample, the components of the heat sink module 100 can be designed suchthat the sub-components (e.g., lid 200, insulator plate 150, heat sinkbody 105) can be assembled in a top down fashion or assembledindividually to provide for streamlined installation and a simplermanufacturing process. For example, the components of the heat sinkmodule 100 can be manufacture and installed in a vertical direction. Aseach component of the heat sink module 100 is modular, each of the lid200, insulator plate 150, and heat sink body 105 can be manufactured,produced or tested before moving on to a next step of assembly.

The heat sink lid 200, the heat sink body 105 and the insulator plate150 can be manufactured separately or manufactured together. The heatsink lid 200, the heat sink body 105 and the insulator plate 150 can becoupled with each other using various techniques, such as but notlimited to welding or brazing processes. The heat sink lid 200 and heatsink body 105 can be die casted or formed using a metal casting process.The shape of the heat sink module 100, and thus that shape of each ofthe heat sink lid 200, the insulator plate 150, and the heat sink body105, can be formed to surround, be disposed about, or disposed aroundelectrical components of an inverter module. For example, the heat sinkmodule 100 can be disposed within an inverter module such that the heatsink lid 200, the insulator plate 150, and the heat sink body 105surround, be disposed about, or disposed around positive terminals orleads of a capacitor coupled with transistors and negative terminals orleads of a capacitor coupled with transistors in an inverter module. Thepositive terminals or leads of the capacitor and the negative terminalsor leads of the capacitor can extend through the open inner regions 225,170, 125 of each of the heat sink lid 200, the insulator plate 150, andthe heat sink body 105, respectively to position cool surfaces andcoolant flowing through the heat sink module 100 closer to theseelectrical components. Thus, the heat sink lid 200, the insulator plate150, and the heat sink body 105 can provide active cooling to each ofthe positive terminals or leads of a capacitor coupled with transistorsand negative terminals or leads of a capacitor coupled with transistorsin an inverter module to reduce inductance value in the inverter moduleand reduce EMI noise in the inverter module.

Providing the heat sink module 100 can include disposing a heat sinkmodule 100 in an inverter module 450 of a drive train unit of anelectric vehicle 405. For example, at least one heat sink module 100 canbe disposed within a power module 300. One or more power modules 300 canbe disposed within an inverter module 450 of a drive train unit. Forexample, three power modules 300, each having at least one heat sinkmodule 100, can be coupled together in a triplet configuration anddisposed within an inverter module 450 to form a three phase invertermodule 450. The inverter module 450 can be disposed within a drive trainunit or a battery pack 410 of an electric vehicle 405. The drive trainunit or the battery pack 410 can include a single inverter module 450 ormultiple inverter modules 300. Providing the heat sink module 100 caninclude providing the heat sink module 100 in an inverter module 450 ofa drive train unit or battery pack 410. The drive train unit, having theinverter module 450, or the battery pack 410, having the inverter module450, can be provided in the electric vehicle 405.

FIG. 6, among others, depicts a method 600 for providing a heat sinkmodule 100 of an inverter module 450 to power an electric vehicle 405.The method 600 can include providing a heat sink 100 (ACT 605). Forexample, the method 600 can include providing a heat sink module 100 ofan inverter module 450 to power an electric vehicle 405. The heat sinkmodule 100 can include a heat sink body 105 having a plurality ofmounting holes 120, a fluid inlet 135 and a fluid outlet 135. The heatsink module 100 can include a cooling channel 130 formed in the heatsink body 105. The cooling channel 130 can be fluidly coupled with thefluid inlet 135 and the fluid outlet 135. The heat sink module 100 caninclude an insulator plate 150 coupled with the heat sink body 105. Theinsulator plate 150 can have a first surface and a second surface. Thesecond surface of the insulator plate 150 can couple with a joiningsurface 145 of the heat sink body 105 to seal the cooling channel 130.The heat sink module 100 can include a heat sink lid 200 disposed overthe first surface of the insulator plate 150. The heat sink lid 200 caninclude a plurality of mounting feet 215 to couple with the mountingholes 120 of the heat sink body 105 to secure the heat sink lid 200 tothe heat sink body 105.

While acts or operations may be depicted in the drawings or described ina particular order, such operations are not required to be performed inthe particular order shown or described, or in sequential order, and alldepicted or described operations are not required to be performed.Actions described herein can be performed in different orders.

Having now described some illustrative implementations, it is apparentthat the foregoing is illustrative and not limiting, having beenpresented by way of example. Features that are described herein in thecontext of separate implementations can also be implemented incombination in a single embodiment or implementation. Features that aredescribed in the context of a single implementation can also beimplemented in multiple implementations separately or in varioussub-combinations. References to implementations or elements or acts ofthe systems and methods herein referred to in the singular may alsoembrace implementations including a plurality of these elements, and anyreferences in plural to any implementation or element or act herein mayalso embrace implementations including only a single element. Referencesin the singular or plural form are not intended to limit the presentlydisclosed systems or methods, their components, acts, or elements tosingle or plural configurations. References to any act or element beingbased on any act or element may include implementations where the act orelement is based at least in part on any act or element.

The phraseology and terminology used herein is for the purpose ofdescription and should not be regarded as limiting. The use of“including” “comprising” “having” “containing” “involving”“characterized by” “characterized in that” and variations thereofherein, is meant to encompass the items listed thereafter, equivalentsthereof, and additional items, as well as alternate implementationsconsisting of the items listed thereafter exclusively. In oneimplementation, the systems and methods described herein consist of one,each combination of more than one, or all of the described elements,acts, or components.

Any references to implementations or elements or acts of the systems andmethods herein referred to in the singular can include implementationsincluding a plurality of these elements, and any references in plural toany implementation or element or act herein can include implementationsincluding only a single element. References in the singular or pluralform are not intended to limit the presently disclosed systems ormethods, their components, acts, or elements to single or pluralconfigurations. References to any act or element being based on anyinformation, act or element may include implementations where the act orelement is based at least in part on any information, act, or element.

Any implementation disclosed herein may be combined with any otherimplementation or embodiment, and references to “an implementation,”“some implementations,” “one implementation” or the like are notnecessarily mutually exclusive and are intended to indicate that aparticular feature, structure, or characteristic described in connectionwith the implementation may be included in at least one implementationor embodiment. Such terms as used herein are not necessarily allreferring to the same implementation. Any implementation may be combinedwith any other implementation, inclusively or exclusively, in any mannerconsistent with the aspects and implementations disclosed herein.

References to “or” may be construed as inclusive so that any termsdescribed using “or” may indicate any of a single, more than one, andall of the described terms. References to at least one of a conjunctivelist of terms may be construed as an inclusive OR to indicate any of asingle, more than one, and all of the described terms. For example, areference to “at least one of ‘A’ and ‘B’” can include only ‘A’, only‘B’, as well as both ‘A’ and ‘B’. Such references used in conjunctionwith “comprising” or other open terminology can include additionalitems.

Where technical features in the drawings, detailed description or anyclaim are followed by reference signs, the reference signs have beenincluded to increase the intelligibility of the drawings, detaileddescription, and claims. Accordingly, neither the reference signs northeir absence have any limiting effect on the scope of any claimelements.

Modifications of described elements and acts such as variations insizes, dimensions, structures, shapes and proportions of the variouselements, values of parameters, mounting arrangements, use of materials,colors, orientations can occur without materially departing from theteachings and advantages of the subject matter disclosed herein. Forexample, elements shown as integrally formed can be constructed ofmultiple parts or elements, the position of elements can be reversed orotherwise varied, and the nature or number of discrete elements orpositions can be altered or varied. Other substitutions, modifications,changes and omissions can also be made in the design, operatingconditions and arrangement of the disclosed elements and operationswithout departing from the scope of the present disclosure.

The systems and methods described herein may be embodied in otherspecific forms without departing from the characteristics thereof. Forexample the voltage across terminals of battery cells can be greaterthan 5V. The foregoing implementations are illustrative rather thanlimiting of the described systems and methods. Scope of the systems andmethods described herein is thus indicated by the appended claims,rather than the foregoing description, and changes that come within themeaning and range of equivalency of the claims are embraced therein.

Systems and methods described herein may be embodied in other specificforms without departing from the characteristics thereof. For example,descriptions of positive and negative electrical characteristics may bereversed. For example, elements described as negative elements caninstead be configured as positive elements and elements described aspositive elements can instead by configured as negative elements.Further relative parallel, perpendicular, vertical or other positioningor orientation descriptions include variations within +/−10% or +/−10degrees of pure vertical, parallel or perpendicular positioning.References to “approximately,” “about” “substantially” or other terms ofdegree include variations of +/−10% from the given measurement, unit, orrange unless explicitly indicated otherwise. Coupled elements can beelectrically, mechanically, or physically coupled with one anotherdirectly or with intervening elements. Scope of the systems and methodsdescribed herein is thus indicated by the appended claims, rather thanthe foregoing description, and changes that come within the meaning andrange of equivalency of the claims are embraced therein.

What is claimed is:
 1. A heat sink module of an inverter module to poweran electric vehicle, comprising: a heat sink body having an open innerregion; a cooling channel formed in the heat sink body; an insulatorplate coupled with the heat sink body to seal the cooling channel; theinsulator plate having an open inner region, the open inner region ofthe insulator plate aligned with the open inner region of the heat sinkbody; and a heat sink lid having an open inner region, the open innerregion of the heat sink lid having a same shape as the open inner regionof the heat sink body.
 2. The heat sink module of claim 1, comprising:the heat sink lid disposed over the insulator plate; and the insulatorplate disposed between the heat sink body and the heat sink lid.
 3. Theheat sink module of claim 1, comprising: the open inner region of theheat sink body having the same shape as the open inner region of theinsulator plate.
 4. The heat sink module of claim 1, comprising: theopen inner region of the heat sink body having the same dimensions asthe open inner region of the insulator plate.
 5. The heat sink module ofclaim 1, comprising: the heat sink body having a fluid inlet and a fluidoutlet; and the cooling channel fluidly coupled with the fluid inlet andthe fluid outlet.
 6. The heat sink module of claim 1, comprising: theheat sink body having a plurality of mounting holes; and a heat sink lidhaving a plurality of mounting feet to couple with the mounting holes ofthe heat sink body to secure the heat sink lid to the heat sink body. 7.The heat sink module of claim 1, comprising: the insulator plate havinga first surface and a second surface; and the second surface of theinsulator plate couples with a joining surface of the heat sink body toseal the cooling channel.
 8. The heat sink module of claim 1,comprising: the insulator plate having a first surface and a secondsurface; the first surface of the insulator plate having a coolingsurface; and the cooling surface coupled with a heat sink lid.
 9. Theheat sink module of claim 1, comprising: multiple cooling channelsformed in the heat sink body, the multiple cooling channels fluidlycoupled with each other, and the multiple cooling channels coupled witha fluid inlet of the heat sink body and a fluid outlet of the heat sinkbody.
 10. The heat sink module of claim 1, comprising: the heat sinkmodule disposed in an inverter module of a drive train unit, the drivetrain unit having multiple inverter modules.
 11. The heat sink module ofclaim 1, comprising: the heat sink module disposed in an inverter moduleof a drive train unit, the drive train unit disposed in an electricvehicle.
 12. An electric vehicle, comprising: a heat sink module for aninverter module of an electric vehicle, the heat sink module comprising:a heat sink body having an open inner region; a cooling channel formedin the heat sink body; an insulator plate coupled with the heat sinkbody to seal the cooling channel; the insulator plate having an openinner region, the open inner region of the insulator plate aligned withthe open inner region of the heat sink body; and a heat sink lid havingan open inner region, the open inner region of the heat sink lid havinga same shape as the open inner region of the heat sink body.
 13. Theelectric vehicle of claim 12, comprising: the heat sink lid disposedover the insulator plate; and the insulator plate disposed between theheat sink body and the heat sink lid.
 14. The electric vehicle of claim12, comprising: the open inner region of the heat sink body having thesame shape as the open inner region of the insulator plate.
 15. Theelectric vehicle of claim 12, comprising: the open inner region of theheat sink body having the same dimensions as the open inner region ofthe insulator plate.
 16. The electric vehicle of claim 12, comprising:the heat sink body having a fluid inlet and a fluid outlet; and thecooling channel fluidly coupled with the fluid inlet and the fluidoutlet.
 17. A method of providing a heat sink module of an invertermodule to power an electric vehicle, the method comprising: providing aheat sink body of a heat sink module, the heat sink body having an openinner region; forming a cooling channel formed in the heat sink body;coupling an insulator plate coupled with the heat sink body to seal thecooling channel, the insulator plate having an open inner region;aligning the open inner region of the insulator plate with the openinner region of the heat sink body; and disposing a heat sink lid overthe insulator plate having an open inner region, the open inner regionof the heat sink lid having a same shape as the open inner region of theheat sink body.
 18. The method of claim 17, comprising: disposing theheat sink lid over the insulator plate, the insulator plate positionedbetween the heat sink body and the heat sink lid.